Substrate-transfer vertical cavity surface emitting laser and method for manufacture thereof

Abstract

A substrate transfer vertical cavity surface emitting laser and method manufacturing thereof are disclosed. The structure of the substrate-transferred vertical-cavity surface-emitting laser comprises: a conductive heat dissipation substrate, a metal adhesion layer and a vertical-cavity surface-emitting laser. A first surface of the conductive heat dissipation substrate is adhered to the vertical-cavity surface-emitting laser chip via the metal adhesion layer. A second surface of the conductive heat dissipation substrate and the side of the vertical-cavity surface-emitting laser film chip that is away from the conductive heat dissipation substrate contains contact electrodes. The first surface and the second surface are two opposite sides of the conductive heat dissipation substrate. The conductive heat dissipation substrate is made of a material with excellent thermal conductivity, which facilitates heat dissipation of the vertical-cavity surface-emitting laser chip. Therefore, the present application significantly improves the power conversion efficiency of the vertical-cavity surface-emitting laser chip.

Dependencies are inferred from the claim text.