Dual-sided socket device with corrugation structures
AssigneeIntel Corporation
InventorsSrikant Nekkanty, Steven Klein, Feroz Mohammad
Life of this patent
Estimating the term…
Loading patent…
AssigneeIntel Corporation
InventorsSrikant Nekkanty, Steven Klein, Feroz Mohammad
Estimating the term…
Techniques and mechanisms for coupling packaged devices with a dual-sided socket device. In an embodiment, two interfaces of the socket device comprise, respectively, first metallization structures and second metallization structures on opposite sides of a socket body structure. The first metallization structures each form a respective corrugation structure to electrically couple with a corresponding conductive contact of a first packaged device. The corrugation structures facilitate such electrical coupling each via a vertical wipe of the corresponding conductive contact. In another embodiment, a pitch of the first metallization structures is in a range of between 0.1 millimeters (mm) and 2 mm. One such metallization structure has a vertical span in a range of between 0.05 mm and 2.0 mm, where a portion of a side of the metallization structure forms a corrugation structure, and has a horizontal span which is at least 5% of the vertical span.
A socket device comprising:
A method comprising:
A system comprising:
Dependencies are inferred from the claim text.