High gain and fan beam antenna structures and associated antenna-in-package
AssigneeMediatek Inc.
InventorsDebapratim Dhara, Shih-Chia Chiu, Yen-Ju Lu, Sheng-Mou Lin
Life of this patent
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Abstract
An antenna structure includes a radiative antenna element disposed in a first conductive layer and a reference ground plane, disposed in a second conductive layer under the first conductive layer. The radiative antenna element is loaded with a plurality of slots and is electrically connected to the reference ground plane through a plurality of vias, and the vias are placed along a first line of the radiative antenna element and the slots are placed along a second line perpendicular to the first line.
Claims20
An antenna structure, comprising:
- a radiative antenna element, disposed in a first conductive layer;
- and
- a reference ground plane, disposed in a second conductive layer under the first conductive layer,
- wherein the radiative antenna element is loaded with a plurality of slots and is electrically connected to the reference ground plane through a plurality of vias, and
- wherein the vias are placed along a first line of the radiative antenna element and the slots are placed along a second line perpendicular to the first line.
An antenna structure, comprising:
- a radiative antenna element, disposed in a first conductive layer;
- a reference ground plane, disposed in a second conductive layer under the first conductive layer;
- and
- a feeding network, comprising a pair of transmission lines disposed in a third conductive layer under the second conductive layer and a pair of differential feeding terminals, wherein the pair of differential feeding terminals is disposed to electrically couple one end of the pair of transmission lines to the radiative antenna element, and
- wherein the radiative antenna element is loaded with a plurality of slots and is electrically connected to the reference ground plane through a plurality of vias.
An antenna-in-package, comprising:
- an antenna structure, comprising:
- a radiative antenna element, disposed in a first conductive layer;
- a reference ground plane, disposed in a second conductive layer under the first conductive layer, wherein the radiative antenna element is loaded with a plurality of slots and is electrically connected to the reference ground plane through a plurality of vias;
- and
- a feeding network, comprising a pair of transmission lines disposed in a third conductive layer under the second conductive layer and a pair of differential feeding terminals, wherein the pair of differential feeding terminals is disposed to electrically couple one end of the pair of transmission lines to the radiative antenna element;
- and
- a semiconductor chip, electrically coupled to the antenna structure through the feeding network.
Dependencies are inferred from the claim text.