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US 2022/0102613 A1Published application
Superconducting circuit provided on an encapsulated vacuum cavity
AssigneeInternational Business Machines Corporation
InventorsIsaac Lauer, Karthik Balakrishnan, Jeffrey Sleight, David James Frank
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Abstract
Devices, systems, methods, and/or computer-implemented methods that can facilitate a qubit device comprising a superconducting circuit provided on an encapsulated vacuum cavity are provided. According to an embodiment, a device can comprise a substrate having an encapsulated vacuum cavity provided on the substrate. The device can further comprise a superconducting circuit provided on the encapsulated vacuum cavity.
Claims20
A device, comprising:
- a substrate having an encapsulated vacuum cavity provided on the substrate;
- and
- a superconducting circuit provided on the encapsulated vacuum cavity.
A method, comprising:
- forming an encapsulated vacuum cavity on a substrate;
- and
- forming a superconducting circuit on the encapsulated vacuum cavity.
A device, comprising:
- a substrate having an encapsulated vacuum cavity provided on the substrate;
- and
- an epitaxial film provided on one or more internal surfaces of the encapsulated vacuum cavity.
Dependencies are inferred from the claim text.