Method of fabricating semiconductor package
AssigneeElectronics and Telecommunications Research Institute
InventorsKwang-Seong CHOI, Yong Sung EOM, Jiho JOO, Gwang-Mun CHOI, Seok-Hwan MOON, Chanmi LEE, Ki Seok JANG
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Abstract
Provided is a method of fabricating a semiconductor package. The method of fabricating the semiconductor package include preparing a lower element including a lower substrate, a lower electrode, an UBM layer, and a reducing agent layer, providing an upper element including an upper substrate, an upper electrode, and a solder bump layer, providing a pressing member on the upper substrate to press the upper substrate to the lower substrate, and providing a laser beam passing through the pressing member to bond the upper element to the lower element.
Claims20
A method of fabricating a semiconductor package, the method comprising:
- preparing a lower element including a lower substrate, a lower electrode on the lower substrate, an under bump metallurgy (UBM) layer on the lower electrode, and a reducing agent layer on the UBM layer;
- providing an upper element including an upper substrate, an upper electrode on the upper substrate, and a solder bump layer on the upper electrode;
- providing a pressing member on the upper substrate to press the upper substrate to the lower substrate;
- and
- providing a laser beam passing through the pressing member to the upper substrate to form the UBM layer, the reducing agent layer, and the solder bump layer as an intermetallic compound layer by using a conductive heat of the upper substrate and the upper electrode.
Dependencies are inferred from the claim text.