Lead frame and housing sub-assembly for use in a light emitting diode package and method for manufacturing the same
AssigneeDominant Opto Technologies Sdn Bhd.
InventorsTek Beng LOW, Chee Sheng LIM
Life of this patent
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Abstract
A lead frame and housing sub-assembly for use in a light emitting diode package, including: a lead frame, wherein the lead frame includes a substrate metal alloy having a top surface and a bottom surface, and wherein the top surface and the bottom surface of the substrate have been pre-plated with a layer of nickel; and a housing, wherein the housing includes a top surface and a bottom surface, and wherein at least a portion of the bottom surface of the housing contacts the top surface of the lead frame that has been pre-plated with the layer of nickel.
Claims19
1-18. (canceled)
A lead frame and housing sub-assembly for use in a light emitting diode package, comprising:
- a lead frame, wherein the lead frame comprises a substrate metal alloy having a top surface and a bottom surface, and wherein the top surface and the bottom surface of the substrate have been pre-plated with a layer of nickel;
- and
- a housing, wherein the housing includes a top surface and a bottom surface, and wherein at least a portion of the bottom surface of the housing contacts the top surface of the lead frame that has been pre-plated with the layer of nickel.
A lead frame and housing sub-assembly for use in a light emitting diode package, comprising:
- a lead frame, wherein the lead frame comprises a substrate metal alloy having a top surface and a bottom surface, and wherein the top surface and the bottom surface of the substrate have been pre-plated with a single layer of nickel having a thickness ranging from 0.5 microns to 3 microns;
- and
- a thermoplastic housing, wherein the thermoplastic housing includes a top surface and a bottom surface, and wherein at least a portion of the bottom surface of the thermoplastic housing contacts the top surface of the lead frame that has been pre-plated with the single layer of nickel.
A method for manufacturing a lead frame and housing sub-assembly for use in a light emitting diode package, comprising the steps of:
- providing a lead frame substrate having a top surface and a bottom surface;
- plating the top surface and bottom surface of the lead frame substrate with a layer of nickel having a thickness ranging from 0.5 microns to 3.0 microns;
- molding a plastic housing onto at least a portion of the lead frame substrate;
- and
- plating any exposed portion of the lead frame substrate with a transition metal and/or transition metal alloy.
Dependencies are inferred from the claim text.