Light emitting devices having profiled side surfaces
OwnerTek Beng LOW, Eng Wah TANinventors
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Abstract
A light emitting diode package, including a substrate having a side surface, wherein the substrate is adapted for mounting one or more light emitting diode light sources thereon; one or more light emitting diode light sources mounted to the substrate; a light conversion component that converts incident light emitted from the one or more light emitting diode light sources; a light reflective encapsulation component having an outermost side surface; and wherein the outermost side surface of the light reflective encapsulation component forms a step with the side surface of the substrate, and wherein both surfaces are non-coplanar.
Claims19
A light emitting diode package, comprising:
- a substrate, wherein the substrate includes a side surface, and wherein the substrate is adapted for mounting one or more light emitting diode light sources thereon;
- at least one light emitting diode light source, wherein the at least one light emitting diode light source is associated with the substrate;
- a light conversion component, wherein the light conversion component converts incident light emitted from the at least one light emitting diode light source;
- a light reflective encapsulation component, wherein the light reflective encapsulation component includes an outermost side surface;
- and
- wherein the outermost side surface of the light reflective encapsulation component forms a step with the side surface of the substrate, and wherein both surfaces are not on the same plane.
A light emitting diode package, comprising:
- a substrate;
- a light emitting diode light source;
- a light conversion component;
- a light reflective encapsulation component;
- and
- wherein a side surface of the light reflective encapsulation component and a side surface of the substrate are non-coplanar.
A method for manufacturing a light emitting diode package, comprising the steps of:
- providing a light emitting diode package comprising:
- a substrate, wherein the substrate includes a side surface, and wherein the substrate is adapted for mounting one or more light emitting diode light sources thereon;
- at least one light emitting diode light source, wherein the at least one light emitting diode light source is associated with the substrate;
- a light conversion component, wherein the light conversion component converts incident light emitted from the at least one light emitting diode light source;
- and
- a light reflective encapsulation component, wherein the light reflective encapsulation component includes an outermost side surface;
- cutting the outermost side surface of the light reflective encapsulation component with a first blade during a first pass;
- and
- cutting the side surface of the substrate with a second blade during a second pass such that the outermost side surface of the light reflective encapsulation component forms a step with the side surface of the substrate, and wherein both surfaces are not on the same plane.
Dependencies are inferred from the claim text.