Light emitting device package having lead electrode with varying height

A package for mounting a light emitting element comprising:

• a first lead electrode defining a portion of a bottom of a recess, wherein the first lead electrode comprises a base member and a plating disposed on the base member, and wherein the first lead electrode comprises, in a plan view:
• a first region,
• a second region surrounding a periphery of the first region, wherein, in a height direction, an upper surface of the base member in an entirety of the second region is higher than an upper surface of the base member in the first region, and
• a third region surrounding at least a portion of a periphery of the second region, wherein, in the height direction, an upper surface of the base member in the third region is lower than the upper surface of the base member in the entirety of the second region;
• a second lead electrode arranged spaced apart from the first lead electrode and defining a portion of the bottom of the recess;
• and
• a resin molded body fixing a portion of the first lead electrode and a portion of the second lead electrode, wherein the resin molded body has a lateral surface defining at least a portion of a lateral side of the recess.