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US 2022/0102591 A1Published application
Electronic package
AssigneeSTMicroelectronics (Grenoble 2) SAS
InventorsOlivier ZANELLATO, Remi BRECHIGNAC, Jerome LOPEZ
Life of this patent
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Abstract
The present description concerns a package for an electronic device. The package including a plate and a lateral wall, separated by a layer made of a bonding material and at least one region made of a material configured to form in the region an opening between the inside and the outside of the package when the package is heated.
Claims19
A package, comprising:
- an electronic device within the package;
- a plate having a first surface overlapping the electronic device;
- a lateral wall having a second surface facing the first surface;
- a layer of a bonding material extends from second surface of the lateral wall to first surface of the plate, the layer couples the plate to the lateral wall;
- and
- at least one region of a material configured to form in the region an opening between an inside and an outside of the package when the package is heated, the at least one region of the material on the lateral wall and extends from the lateral wall to the first surface of the plate.
3 more elements
A method, comprising:
- forming a package including:
- forming a layer of resin on a support;
- coupling a plate to the layer of resin by forming a layer of bonding material on the layer of resin and depositing the plate on the layer of bonding material;
- forming of a layer made of a bonding material on the layer of resin;
- forming at least one region of a material having physical properties that change when the package is heated;
- and
- forming an opening extending from an inner cavity of the package to an external environment outside the package along the at least one region of the material by heating the package.
4 more elements
A device, comprising:
- a package including:
- a support;
- a layer of resin on the support, the layer of resin including:
- a first surface;
- a second surface;
- and
- a first protrusion that extends outward from the layer of resin and separates the first surface from the second surface;
- a plate on the first protrusion of the layer of resin;
- a layer of a bonding material on the first surface couples the plate to the layer of resin;
- an inner cavity delimited by the support, the layer of resin, the plate, and the layer of the bonding material;
- a layer of a material on the second surface separated from the layer of the bonding material by the protrusion of the layer of resin, the layer of the material extends from the second surface of the layer of resin to the plate, the layer of the material configured to form an opening that extends from the inner cavity to an external environment outside of the package when the package is heated.
8 more elements
Dependencies are inferred from the claim text.