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US 2022/0102580 A1Published application
Wafer bonding for embedding active regions with relaxed nanofeatures
AssigneeThe Regents of the University of California
InventorsCaroline E. Reilly, Umesh K. Mishra, Stacia Keller, Steven P. DenBaars
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Abstract
A method for fabricating a device, as well as the device itself, which includes growing a bonding layer on a first wafer or substrate, wherein the bonding layer includes at least partially relaxed features; and then bonding a second wafer or substrate to the features in on the first wafer or substrate, to cap and contact the features with separately grown material.
Claims21
A method of making a device, comprising:
- (a) forming one or more at least partially relaxed features comprising one or more planar layers, one or more nanostructures, and/or one or more microstructures, on a first substrate;
- and
- (b) bonding a second substrate to the at least partially relaxed features on the first substrate.
A device, comprising:
- at least partially relaxed features formed on a first substrate;
- and
- a second substrate bonded to the at least partially relaxed features.
-33. (canceled)
Dependencies are inferred from the claim text.