Optical sensor package and manufacturing method for the same

A manufacturing method of an optical sensor package, comprising:

• disposing a chip on a circuit board, the chip having a light emitting area and a light receiving area;
• disposing at least one light emitting element on the light emitting area of the chip, the at least one light emitting element being electrically connected to the circuit board;
• coating a light blocking material between the light emitting area and the light receiving area;
• filling a light permeable material that covers the circuit board, the chip, the light blocking material, and the at least one light emitting element;
• removing a part of the light permeable material disposed between the light emitting area and the light receiving area, so as to form a first recess and expose a part of the light blocking material;
• and
• filling an anti-light-leakage material in the first recess to form a lateral light blocking structure through stacking the anti-light-leakage material and the light blocking material, so as to block light emitted by the at least one light emitting element from being laterally transmitted to the light receiving area.