Sensor package array, method of manufacturing the same, and sensor package structure
AssigneeLite-On Singapore Pte. Ltd.
InventorsGUANG-LI SONG, WEI-CHEE LEE, QIAN PANG
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Abstract
A sensor package array, a method of manufacturing the same, and a sensor package structure are provided. The method of manufacturing a sensor package array including: disposing a plurality of sensors on a substrate sequentially in an array; electrically connecting the plurality of sensors to the substrate; disposing a plastic shield on the substrate, so as to form a plurality of channels and a plurality of accommodating grooves among the plastic shield, the substrate, and the plurality of sensors; and filling a sealing material in the plurality of accommodating grooves, through the plurality of channels.
Claims19
A method of manufacturing a sensor package array, comprising:
- sequentially disposing a plurality of sensors on a substrate in an array;
- electrically connecting the plurality of sensors to the substrate;
- disposing a plastic shield on the substrate, so as to form a plurality of channels and a plurality of accommodating grooves among the plastic shield, the substrate, and the plurality of sensors, wherein the plastic shield includes a plurality of openings that respectively correspond to the plurality of sensors;
- and
- filling a sealing material in the plurality of accommodating grooves among the plastic shield, the substrate, and the plurality of sensors through the plurality of channels.
A sensor package array, comprising:
- a substrate;
- a plurality of sensors being disposed on the substrate sequentially in an array, wherein each of the plurality of sensors includes one of a plurality of emitters and one of a plurality of detectors, and each of the plurality of emitters and the plurality of detectors are respectively electrically connected to the substrate;
- and
- a plastic shield being disposed on the substrate including a plurality of first openings, a plurality of second openings, and a plurality of barrier walls, wherein each of the plurality of first openings and each of the plurality of second openings are respectively positioned to correspond to each of the plurality of emitters and each of the plurality of detectors, and the barrier wall is disposed between each of the plurality of emitters and each of the plurality of detectors;
- wherein a plurality of channels and a plurality of accommodating grooves are formed between the plastic shield and the substrate, and a sealant is filled in the plurality of accommodating grooves through the plurality of channels, such that the plastic shield is fixed on the substrate via the sealant.
Dependencies are inferred from the claim text.