Gan-hemt device with sandwich structure and method for preparing the same
AssigneeSouth China University of Technology
InventorsGuoqiang LI, Dingbo CHEN, Zhikun LIU, Lijun WAN
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AssigneeSouth China University of Technology
InventorsGuoqiang LI, Dingbo CHEN, Zhikun LIU, Lijun WAN
Estimating the term…
A GaN-HEMT device with a sandwich structure and a method for preparing the same are provided. The GaN-HEMT device includes an epitaxial layer and electrodes, wherein the epitaxial layer includes a GaN channel layer (2) and an AlyGa1-y barrier layer (1), and is arranged from top to bottom; the electrodes include a gate electrode (6), a source electrode (7), a drain electrode (5) and a field plate electrode (10), wherein the field plate electrode (10) and the gate electrode (6) are respectively fabricated on an upper surface and a lower surface of the epitaxial layer, and the field plate electrode (10) extends to a region beyond the epitaxial layer and is connected with the gate electrode (6) to form the sandwich structure, and the source electrode (7) and the drain electrode (5) are respectively located at two ends of the epitaxial layer.
A GaN-HEMT device with a sandwich structure, wherein the GaN-HEMT device comprises an epitaxial layer and electrodes, wherein the epitaxial layer comprises a GaN channel layer and an AlyGa1-yN barrier layer, and y is 0.2 to 0.3;
Dependencies are inferred from the claim text.