Back to results
US 2022/0102539 A1Published application
Integrated Assemblies and Methods of Forming Integrated Assemblies
AssigneeMicron Technology, Inc.
InventorsDavid K. Hwang, John F. Kaeding, Richard J. Hill, Scott E. Sills
Life of this patent
Estimating the term…
Abstract
Some embodiments include an integrated assembly having a conductive structure, an annular structure extending through the conductive structure, and an active-material-structure lining an interior periphery of the annular structure. The annular structure includes dielectric material. The active-material-structure includes two-dimensional-material. Some embodiments include methods of forming integrated assemblies.
Claims30
An integrated assembly, comprising:
- a conductive line;
- a conductive structure over the conductive line;
- an annular structure extending through the conductive structure, the annular structure comprising dielectric material;
- and
- an active-material-structure lining an interior periphery of the annular structure, the active-material-structure comprising two-dimensional-material, the active-material-structure having an annular portion having an upper region, a lower region and an intermediate region between the upper region and the lower region, the active-material-structure having a base portion entirely closing a bottom of the lower region of the annular structure, an entirety of a bottom surface of the base being in direct physical contact with the conductive line.
2 more elements
An integrated assembly, comprising:
- a conductive structure;
- an annular structure extending through the conductive structure, the annular structure comprising dielectric material;
- an active-material-structure lining an interior periphery of the annular structure, the active-material-structure comprising two-dimensional-material;
- the annular structure and the active-material-structure have upper surfaces above an upper surface of the conductive structure;
- a conductive material over the upper surfaces of the annular structure and the active-material-structure and capping an interior region of the active-material-structure;
- and
- a void within said interior region.
4 more elements
An integrated assembly, comprising:
- a conductive structure;
- an annular structure extending through the conductive structure, the annular structure comprising dielectric material;
- an active-material-structure lining an interior periphery of the annular structure, the active-material-structure comprising two-dimensional-material;
- the annular structure and the active-material-structure have upper surfaces above an upper surface of the conductive structure;
- a conductive material over the upper surfaces of the annular structure and the active-material-structure and capping an interior region of the active-material-structure;
- and
- insulative material within said interior region.
4 more elements
20-22. (canceled)
An integrated assembly, comprising:
- first conductive structures extending along a first direction;
- first insulative material over the first conductive structures;
- second conductive structures over the first insulative material and extending along a second direction which crosses the first direction;
- insulative rings extending through the second conductive structures;
- active-material-structures lining interior peripheries of the insulative rings, the active-material-structures comprising two-dimensional-material;
- the active-material-structures having lower source/drain regions beneath the second conductive structures, upper source/drain regions above the second conductive structures, and channel regions between the upper and lower source/drain regions;
- the lower source/drain regions being electrically coupled with the first conductive structures;
- and
- storage elements electrically coupled with the upper source/drain regions.
6 more elements
31-38. (canceled)
Dependencies are inferred from the claim text.