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US 2022/0102408 A1Published application
Solid-state imaging device, manufacturing method thereof, and camera with alternatively arranged pixel combinations
AssigneeSony Semiconductor Solutions Corporation
InventorsHiroaki Ishiwata, Sanghoon Ha
Life of this patent
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Abstract
A solid-state imaging device includes a semiconductor substrate; and a pixel unit having a plurality of pixels on the semiconductor substrate, wherein the pixel unit includes first pixel groups having two or more pixels and second pixel groups being different from the first pixel groups, wherein a portion of the pixels in the first pixel groups and a portion of the pixels in the second pixel groups share a floating diffusion element.
Claims12
1-9. (canceled)
A light detecting device, comprising:
- a pixel unit comprising:
- a first insulating film having a first opening corresponding to a plurality of photoelectric conversion regions, each of the plurality of the photoelectric conversion regions being configured to receive light of a first color through the first opening;
- and
- a second insulating film having a second opening corresponding to a first single photoelectric conversion region, the first single photoelectric conversion region being configured to receive light of a second color through the second opening, and the second opening having a size smaller than a size of the first opening.
1 more element
Dependencies are inferred from the claim text.