Package structure, packaging method, camera module, and electronic equipment

A camera module, comprising:

• a package structure having a chip package module, wherein the chip package module comprises:
• a transparent substrate;
• a wiring layer located on a side of the light-transmitting substrate and comprising a first metal wire;
• a conductor located on a side of the wiring layer facing away from the light-transmitting substrate, wherein the conductor comprises a first end electrically connected to the first metal wire, and a second end;
• a photosensitive chip located on the side of the wiring layer facing away from the light-transmitting substrate, wherein the photosensitive chip comprises a pin electrically connected to the first metal wire and having a photosensitive surface configured to sense a photometric signal, and the photosensitive surface faces towards the light-transmitting substrate and comprises a photosensitive region that is not overlapping the first metal wire in a direction perpendicular to a principal plane of the light-transmitting substrate;
• an active chip located on the side of the wiring layer facing away from the light-transmitting substrate and comprising a pin electrically connected to the first metal wire;
• and
• an encapsulation layer that encapsulates the photosensitive chip and the active chip;
• and
• a lens assembly comprising a housing and at least one lens located in the housing, wherein the at least one lens is located on a side of the light-transmitting substrate facing away from the photosensitive chip in the package structure, and the at least one lens overlaps the photosensitive region of the photosensitive chip in the direction perpendicular to a principal plane of the light-transmitting substrate.