Semiconductor module manufacturing method, electronic equipment manufacturing method, semiconductor module, and electronic equipment

A semiconductor module comprising:

• a printed wiring board;
• a semiconductor device comprising a first land and a second land, the semiconductor device being mounted on the printed wiring board;
• a chip component comprising a first electrode and a second electrode spaced apart from each other in a predetermined direction, the chip component being disposed between the printed wiring board and the semiconductor device;
• a first solder bonding portion that bonds the first electrode and the first land to each other;
• and
• a second solder bonding portion that bonds the second electrode and the second land to each other,
• wherein the printed wiring board comprises an insulating substrate and a solder resist disposed on a main surface of the insulating substrate,
• the chip component faces the solder resist,
• each of the first land and the second land overlaps at least a portion of each of the first electrode and the second electrode in a plan vie and extends outward in the predetermined direction from the chip component,
• the first solder bonding portion has a fillet shape in which the first solder bonding portion spreads outward in the predetermined direction from the first electrode as the first solder bonding portion extends toward the first land from the solder resist, and
• the second solder bonding portion has a fillet shape in which the second solder bonding portion spreads outward in the predetermined direction from the second electrode as the second solder bonding portion extends toward the second land from the solder resist.

A semiconductor module comprising:

• a printed wiring board;
• a semiconductor device comprising a first land and a second land, the semiconductor device being mounted on the printed wiring board;
• a chip component comprising a first electrode and a second electrode spaced apart from each other in a predetermined direction, the chip component being disposed between the printed wiring board and the semiconductor device;
• a first solder bonding portion that bonds the first electrode and the first land to each other;
• and
• a second solder bonding portion that bonds the second electrode and the second land to each other,
• wherein the printed wiring board comprises an insulating substrate, a third land disposed on a main surface of the insulating substrate and electrically connected to the first land by the first solder bonding portion, and a fourth land disposed on the main surface of the insulating substrate and electrically connected to the second land by the second solder bonding portion,
• in a plan view, each of the first land and the second land overlaps at least a portion of each of the first electrode and the second electrode, overlaps at least a portion of each of the third land and the fourth land, and extends outward in the predetermined direction from the chip component,
• the first solder bonding portion has a fillet shape in which the first solder bonding portion spreads outward in the predetermined direction from the first electrode as the first solder bonding portion extends toward the first land from the third land, and
• the second solder bonding portion has a fillet shape in which the second solder bonding portion spreads outward in the predetermined direction from the second electrode as the second solder bonding portion extends toward the second land from the fourth land.

A semiconductor module comprising:

• a printed wiring board;
• a semiconductor device comprising a first land and a second land, the semiconductor device being mounted on the printed wiring board;
• a chip component comprising a first electrode and a second electrode spaced apart from each other in a predetermined direction, the chip component being disposed between the printed wiring board and the semiconductor device;
• a first solder bonding portion that bonds the first electrode and the first land to each other;
• and
• a second solder bonding portion that bonds the second electrode and the second land to each other,
• wherein the printed wiring board comprises an insulating substrate and a solder resist disposed on a main surface of the insulating substrate,
• the solder resist has an opening portion into which a portion of the chip component is inserted,
• each of the first land and the second land overlaps at least a portion of each of the first electrode and the second electrode in a plan view and extends outward in the predetermined direction from the chip component,
• the first solder bonding portion has a fillet shape in which the first solder bonding portion spreads outward in the predetermined direction from the first electrode as the first solder bonding portion extends toward the first land from a portion of the main surface of the insulating substrate exposed by the opening portion of the solder resist, and
• the second solder bonding portion has a fillet shape in which the second solder bonding portion spreads outward in the predetermined direction from the second electrode as the second solder bonding portion extends toward the second land from the portion of the main surface of the insulating substrate exposed by the opening portion of the solder resist.