Method for manufacturing semiconductor structure
AssigneeNanya Technology Corporation
InventorsTING-CIH KANG, HSIH-YANG CHIU
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Abstract
The present disclosure provides a method for manufacturing a semiconductor structure employing a via structure. The method includes forming a first conductive pad on a first semiconductor device; forming a second conductive pad on the first conductive pad; connecting a second semiconductor device to the first semiconductor device; and forming a via structure in the second semiconductor device, The via structure contacts the second conductive pad, and the first conductive pad and the second conductive pad are formed of different metal materials.
Claims11
A method of manufacturing a semiconductor structure, comprising:
- forming a first conductive pad on a first semiconductor device;
- forming a second conductive pad on the first conductive pad;
- connecting a second semiconductor device to the first semiconductor device;
- and
- forming a via structure in the second semiconductor device, wherein the via structure contacts the second conductive pad;
- wherein the first conductive pad and the second conductive pad are formed of different metal materials.
Dependencies are inferred from the claim text.