Semiconductor device

A semiconductor device, comprising:

• a semiconductor unit including a main circuit board, which includes an insulating plate, a circuit pattern formed on a front surface of the insulating plate, and a metal plate formed on a rear surface of the insulating plate, and a semiconductor chip bonded to the circuit pattern;
• a printed circuit board;
• and
• a case including a bottom portion formed in a plate-like shape and having a front surface and a rear surface opposite to each other, the rear surface facing outside the case, and a side wall portion surrounding an outer periphery of the bottom portion of the case, wherein
• the bottom portion has
• a main circuit area having an opening, the semiconductor unit being attached in the main circuit area from the rear surface of the bottom portion such that the insulating plate is exposed to inside the case through the opening, and
• a control circuit area adjacent to the main circuit area in a plan view of the semiconductor device, the printed circuit board being disposed in the control circuit area on the front surface of the bottom portion via a spacer, having a gap between the printed circuit board and the front surface of the bottom portion.