Semiconductor package

A semiconductor package, comprising:

• a first sub-package including:
• a first package substrate,
• a first semiconductor chip on the first package substrate,
• a plurality of first chip connection units between the first package substrate and the first semiconductor chip,
• an interposer on the first semiconductor chip and having a width greater than a width of the first semiconductor chip in a direction parallel to an upper surface of the first package substrate,
• a wire connecting the interposer to the first package substrate;
• an upper filling layer filling a space between the interposer and the first semiconductor chip, and
• a lower filling layer filling a space between the first semiconductor chip and the first package substrate;
• and
• a second sub-package including:
• a plurality of inter-package connection units on the interposer,
• a second package substrate on the plurality of inter-package connection units,
• at least one second semiconductor chip on the second package substrate, and
• a molding unit surrounding the at least one second semiconductor chip and covering an upper surface of the second package substrate,
• wherein at least one of the upper filling layer and the lower filling layer is in contact with a sidewall of the first semiconductor chip.

A semiconductor package, comprising:

• a first package substrate;
• a first semiconductor chip on the first package substrate;
• a plurality of first chip connection units between the first package substrate and the first semiconductor chip;
• an interposer on the first semiconductor chip and having a width greater than a width of the first semiconductor chip in a direction parallel to an upper surface of the first package substrate;
• an upper filling layer filling a space between the interposer and the first semiconductor chip, the upper filling layer being in direct contact with the first package substrate;
• and
• a lower filling layer filling a space between the first semiconductor chip and the first package substrate.