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US 2022/0102313 A1Published application
Embedded Stress Absorber in Package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShin-Puu Jeng, Chien-Sheng Chen, Po-Yao Lin, Po-Chen Lai, Shu-Shen Yeh
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Abstract
A method includes bonding a first package component over a second package component. The second package component includes a plurality of dielectric layers, and a plurality of redistribution lines in the plurality of dielectric layers. The method further includes dispensing a stress absorber on the second package component, curing the stress absorber, and forming an encapsulant on the second package component and the stress absorber.
Claims20
A method comprising:
- bonding a first package component over a second package component, wherein the second package component comprises:
- a plurality of dielectric layers;
- and
- a plurality of redistribution lines in the plurality of dielectric layers;
- dispensing a stress absorber on the second package component;
- curing the stress absorber;
- and
- forming an encapsulant on the second package component and the stress absorber.
5 more elements
A package comprising:
- an interconnect structure comprising:
- a plurality of dielectric layers;
- and
- a plurality of redistribution lines in the plurality of dielectric layers;
- a package component over the interconnect structure, wherein the package component comprises a device die;
- a stress absorber over the interconnect structure, wherein the stress absorber has a first Young's modulus;
- and
- an encapsulant on the package component and the stress absorber, wherein the encapsulant has a second Young's modulus greater than the first Young's modulus.
5 more elements
A package comprising:
- a first package component comprising:
- an interconnect structure comprising:
- a plurality of dielectric layers;
- and
- a plurality of redistribution lines in the plurality of dielectric layers;
- a second package component over and bonded to the interconnect structure, wherein the second package component comprises a device die;
- a plurality of stress absorbers over the interconnect structure, wherein the plurality of stress absorbers comprise a corner stress absorber close to a corner of the interconnect structure, and wherein the plurality of stress absorbers comprise a first organic material;
- and
- an encapsulant physically contacting at least sidewalls of the corner stress absorber, wherein the encapsulant comprises a second organic material different from the first organic material.
6 more elements
Dependencies are inferred from the claim text.