Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsTakuya KITABAYASHI, Hiroyuki MASUMOTO
Life of this patent
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Abstract
A semiconductor device includes: an insulating substrate; a first semiconductor element connected to the insulating substrate; a conductive member disposed on the insulating substrate, and including a first opposing portion and a second opposing portion located opposite each other with respect to the first semiconductor element in plan view; a first wire connected to the first semiconductor element and the first opposing portion; and a second wire connected to the first semiconductor element and the second opposing portion, and located opposite the first wire with respect to a connection point where the first wire and the first semiconductor element are connected to each other in plan view.
Claims9
A semiconductor device comprising:
- an insulating substrate;
- a first semiconductor element connected to the insulating substrate;
- a conductive member disposed on the insulating substrate, and including a first opposing portion and a second opposing portion located opposite each other with respect to the first semiconductor element in plan view and electrically connected to each other;
- a first wire connected to the first semiconductor element and the first opposing portion;
- and
- a second wire connected to the first semiconductor element and the second opposing portion, and located opposite the first wire with respect to a connection point in plan view, the connection point being a point where the first wire and the first semiconductor element are connected to each other.
Dependencies are inferred from the claim text.