Semiconductor device module having vertical metallic contacts and a method for fabricating the same
AssigneeInfineon Technologies Austria AG
InventorsEdward Fuergut, Martin Gruber, Petteri Palm, Bernd Schmoelzer, Wolfgang Scholz, Mark Thomas
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Abstract
A semiconductor device module includes a package carrier having an opening, wherein in the opening there is disposed a semiconductor package including a semiconductor die, an encapsulant, and first vertical contacts, wherein the encapsulant at least partially covers the semiconductor die, and the first vertical contacts are connected to the semiconductor die and extend at least partially through the encapsulant, and a first outer metallic contact layer electrically connected to the first vertical contacts.
Claims21
A semiconductor device module, comprising:
- a package carrier comprising an opening, wherein in the opening there is disposed a semiconductor package comprising:
- a semiconductor die, an encapsulant, and first vertical contacts, wherein the encapsulant at least partially covers the semiconductor die, and the first vertical contacts are connected to the semiconductor die;
- and
- a first outer metallic contact layer electrically connected to the first vertical contacts.
A method for fabricating a semiconductor device module, the method comprising:
- fabricating a semiconductor die package by providing a semiconductor die, connecting first vertical contacts to the contact pad, covering at least partially the semiconductor die by an encapsulant;
- providing a package carrier comprising an opening;
- placing the semiconductor die package in the opening;
- and
- electrically connecting a first outer metallic contact layer to the first vertical contacts.
Dependencies are inferred from the claim text.