Semiconductor device and method for producing same
AssigneeNagase & Co., Ltd.
InventorsMichihiro SATO, Tadashi TAKANO
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Abstract
The occurrence of a positional shift of a semiconductor chip during resin sealing is suppressed; and a redistribution layer is easily and accurately formed. A semiconductor device according to the present invention is provided with: a substrate which is formed of a cured thermosetting resin, and which has one or more recesses; a circuit element which is arranged within a recess of the substrate; and a redistribution layer which is connected to the circuit element on the opening side of the recess.
Claims20
A semiconductor device comprising:
- a substrate formed of a cured thermosetting resin and having one or a plurality of recesses;
- a circuit element disposed in the recess of the substrate;
- and
- a redistribution layer connected to the circuit element on an opening side of the recess.
A semiconductor device comprising:
- a substrate formed of a cured thermosetting resin, wherein the substrate has a first surface and a second surface, wherein the substrate has one or a plurality of recesses formed on both the first surface and the second surface;
- circuit elements disposed in the recesses on both the first surface and the second surface;
- redistribution layers connected to the circuit elements on opening sides of the recesses on both the first surface and the second surface;
- and
- a through-via passing through the substrate in a thickness direction in peripheral areas of the recesses,
- wherein the redistribution layers on the first surface and the second surface are electrically connected via the through-via.
A method for producing a semiconductor device, comprising:
- a step of forming a substrate by heat-curing a thermosetting resin after molding the thermosetting resin into a shape having one or a plurality of recesses;
- a step of disposing a circuit element in the recess of the substrate;
- and
- a step of connecting a redistribution layer to the circuit element on an opening side of the recess.
Dependencies are inferred from the claim text.