Dielectric and metallic nanowire bond layers
AssigneeTexas Instruments Incorporated
InventorsScott Robert SUMMERFELT, Benjamin Stassen COOK, Ralf Jakobskrueger MUENSTER, Sreenivasan Kalyani KODURI
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Abstract
In some examples, an electronic device comprises a first component having a surface, a second component having a surface, and a bond layer positioned between the surfaces of the first and second components to couple the first and second components to each other. The bond layer includes a set of metallic nanowires and a dielectric portion. The dielectric portion comprises a polymer matrix and dielectric nanoparticles.
Claims19
A method of forming an electronic device, the method comprising:
- providing a first die including a first surface and a second die including a second surface;
- and
- positioning a bond layer positioned between the first surface and second surface the bond layer including a set of metallic wires and a dielectric portion, the dielectric portion comprising a polymer matrix and dielectric nanoparticles.
A method of forming an electronic device, the method comprising:
- providing a component having a surface;
- forming a metal layer on a first portion of the surface of the component;
- forming a set of metallic nanoparticles on the metal layer;
- forming a set of metallic nanowires coupled to the set of metallic nanoparticles;
- and
- positioning a dielectric layer positioned on a second portion of the surface of the component, the dielectric layer including a polymer matrix and a set of dielectric particles.
A method for fabricating an electronic device, comprising:
- positioning a metal layer above a surface of a component;
- plating a set of metallic nanowires on the metal layer;
- and
- positioning a dielectric layer above the surface of the component, the dielectric layer comprising a polymer matrix, a solvent, and a set of nanoparticles,
- wherein the metal layer and the dielectric layer are positioned above different portions of the surface of the component.
Dependencies are inferred from the claim text.