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US 2022/0102305 A1Published application
Singulation of microelectronic components with direct bonding interfaces
AssigneeIntel Corporation
InventorsBhaskar Jyoti Krishnatreya, Nagatoshi Tsunoda, Shawna M. Liff, Sairam Agraharam
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Abstract
Disclosed herein are structures and techniques related to singulation of microelectronic components with direct bonding interfaces. For example, in some embodiments, a microelectronic component may include: a surface, wherein conductive contacts are at the surface; a trench at a perimeter of the surface; and a burr in the trench.
Claims20
A microelectronic component, comprising:
- a surface, wherein conductive contacts are at the surface;
- a trench at a perimeter of the surface;
- and
- a burr in the trench.
1 more element
A microelectronic assembly, comprising:
- a first microelectronic component having a face having a first direct bonding interface, wherein the first microelectronic component has a trench at a perimeter of the face;
- and
- a second microelectronic component having a second direct bonding interface, wherein the first direct bonding interface is direct bonded to the second direct bonding interface.
A system, comprising:
- a circuit board;
- and
- a microelectronic assembly, communicatively coupled to the circuit board, wherein the microelectronic assembly includes a face of a first microelectronic component direct bonded to a face of a second microelectronic component, and the face of the first microelectronic component includes a trench at its edges.
Dependencies are inferred from the claim text.