Semiconductor device and method for manufacturing semiconductor device

A method for manufacturing a semiconductor device, comprising:

• forming an electrode structure on a semiconductor element having one surface with a plurality of electrode pads made of a conductor, the electrode structure including a plurality of metal terminals made of a conductor and a sealing resin, the metal terminals being disposed in a region along a circumference of the one surface on the one surface and electrically connected to the respective plurality of electrode pads, the sealing resin holding the plurality of metal terminals and being formed on the one surface of the semiconductor element to cover the one surface, the electrode structure including a first surface opposed to the one surface and a second surface positioned in an opposite side of the first surface;
• exposing each of the plurality of metal terminals from the sealing resin in at least a part of the second surface of the electrode structure and at least a part of a third surface positioned between the first surface and the second surface and continuous with the second surface;
• and
• individualizing a plurality of the semiconductor devices formed on a wafer.