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US 2022/0102299 A1Published application
Package with pad having open notch
AssigneeInfineon Technologies AG
InventorAdrian LIS
Life of this patent
Estimating the term…
Abstract
A package is disclosed. In one example, the package comprises an electronic component having a first main surface with an electrically conductive first pad. The first pad has an open notch, and a spacer body mounted on the first pad and bridging at least part of the open notch.
Claims19
A package which comprises:
- an electronic component having a first main surface with an electrically conductive first pad, the first pad having an open notch;
- and
- a spacer body mounted on the first pad and bridging at least part of the open notch,
- wherein the electronic component has an electrically conductive second pad on the first main surface;
- wherein the second pad is arranged so as to be substantially equidistantly spaced from the first pad along the open notch of the first pad;
- wherein the second pad is shaped in accordance with at least one of the group consisting of a circular shape, a hexagon shape, and an octagon shape.
3 more elements
A package, which comprises:
- an electronic component having a first main surface with an electrically conductive first pad, the first pad having an open notch;
- and
- a spacer body having an open notch and being mounted on the first pad so that the open notch of the first pad overlaps at least partially with the open notch of the spacer body,
- wherein the electronic component has an electrically conductive second pad on the first main surface;
- wherein the second pad is arranged so as to be substantially equidistantly spaced from the first pad along the open notch of the first pad;
- wherein the second pad is shaped in accordance with at least one of the group consisting of a circular shape, a hexagon shape, and an octagon shape.
3 more elements
A method of manufacturing a package, wherein the method comprises:
- providing an electronic component having a first main surface with an electrically conductive first pad, the first pad having an open notch,
- mounting a spacer body on the first pad so that the spacer body bridges at least part of the open notch,
- wherein the electronic component has an electrically conductive second pad on the first main surface,
- wherein the second pad is arranged so as to be substantially equidistantly spaced from the first pad along the open notch of the first pad, and
- wherein the second pad is shaped in accordance with at least one of the group consisting of a circular shape, a hexagon shape, and an octagon shape.
2 more elements
A method of manufacturing a package, wherein the method comprises:
- providing an electronic component having a first main surface with an electrically conductive first pad, the first pad having an open notch,
- mounting a spacer body, having an open notch, on the first pad so that the open notch of the first pad overlaps at least partially with the open notch of the spacer body,
- wherein the electronic component has an electrically conductive second pad on the first main surface,
- wherein the second pad is arranged so as to be substantially equidistantly spaced from the first pad along the open notch of the first pad, and
- wherein the second pad is shaped in accordance with at least one of the group consisting of a circular shape, a hexagon shape, and an octagon shape.
2 more elements
A package, comprising:
- an electronic component with an electrically conductive first pad having an open notch and with an electrically conductive second pad;
- wherein the second pad is arranged so as to be substantially equidistantly spaced from the first pad along the open notch;
- and
- wherein the second pad is shaped in accordance with at least one of the group consisting of a circular shape, a hexagon shape, and an octagon shape.
1 more element
A method of manufacturing a package, wherein the method comprises:
- providing an electronic component with an electrically conductive first pad having an open notch and with an electrically conductive second pad;
- arranging the second pad so as to be substantially equidistantly spaced from the first pad along the open notch, and
- wherein the second pad is shaped in accordance with at least one of the group consisting of a circular shape, a hexagon shape, and an octagon shape.
Dependencies are inferred from the claim text.