Bump pad structure
AssigneeQUALCOMM Incorporated
InventorsKuiwon KANG, Michelle Yejin KIM, Marcus HSU
Life of this patent
Estimating the term…
Abstract
Aspects disclosed herein include a device including a bump pad structure and methods for fabricating the same. The device includes a bump pad. The device also includes a first trace adjacent the bump pad, where a first trace top surface is recessed a first recess distance from a bump pad top surface. The device also includes a second trace adjacent the first trace, covered at least in part by a solder resist. The device also includes a substrate, where the bump pad, the first trace, and the second trace are each formed on a portion of the substrate.
Claims30
A device, comprising:
- a bump pad;
- a first trace adjacent the bump pad, wherein a first trace top surface is recessed a first recess distance from a bump pad top surface;
- a second trace adjacent the first trace, covered at least in part by a solder resist;
- and
- a substrate, wherein the bump pad, the first trace, and the second trace are each formed on a portion of the substrate.
A method of fabricating a device, comprising:
- forming a bump pad;
- forming a first trace adjacent the bump pad, wherein a first trace top surface is recessed a first recess distance from a bump pad top surface;
- forming a second trace adjacent the first trace, covered at least in part by a solder resist;
- and
- providing a substrate, wherein the bump pad, the first trace, and the second trace are each formed on a portion of the substrate.
Dependencies are inferred from the claim text.