Radio-frequency module and communication device

A radio-frequency module comprising:

• a mounting substrate having a first main surface and a second main surface on opposite sides of the mounting substrate;
• an electronic component mounted on the first main surface of the mounting substrate;
• and
• a first chip component and a second chip component mounted on the second main surface of the mounting substrate,
• wherein the first chip component and the second chip component include:
• a substrate having a first main substrate surface and a second main substrate surface on opposite sides of the substrate;
• and
• a circuit portion formed on the first main substrate surface side of the substrate,
• a material of the substrate in the first chip component and a material of the substrate in the second chip component are a same material, and
• under a condition a plane including a bonding region with a bump connected to the first chip component on the second main surface of the mounting substrate is defined as a reference plane,
• the first chip component and the second chip component have the same distance between the reference plane and the second main substrate surface of the substrate in a thickness direction of the mounting substrate.