Substrate with gradiated dielectric for reducing impedance mismatch

A method of making an increased impedance via in an electrical circuit, comprising:

• forming, in a substrate, a bore transverse to a first side of the substrate and extending from the first side to a second side of the substrate;
• disposing a material in the bore, the material confined to the bore, wherein the substrate includes a first dielectric characteristic and the material includes a second dielectric characteristic, the second dielectric characteristic different than the first dielectric characteristic;
• and
• forming a conductive path at least partially through the material, including:
• forming a hole at least partially through the material, the hole extended through the substrate,
• disposing a conductive material in the hole to form a conductive path through the hole, and
• electrically coupling the conductive material to a first conductive layer and a second conductive layer.

An electronic package including a substrate having a gradiated dielectric characteristic, the electronic package comprising:

• an electronic circuit including:
• a substrate having a first side and a second side, the substrate including a first dielectric characteristic, the substrate further including a bore transverse to the first side, the bore extending from the first side to the second side;
• a material disposed within the bore, the material located between the first side and the second side, the material including a second dielectric characteristic, wherein the second dielectric characteristic is different than the first dielectric characteristic;
• a first conductive layer disposed on the first side and a second conductive layer disposed on the second side;
• a conductive path electrically coupled between the first conductive layer and the second conductive layer and positioned in a hole in the material, wherein the conductive path is in contact with at least a portion of the material;
• and
• a die electrically coupled to the electronic circuit to electrically communicate through the conductive path.