Communication between integrated circuit (ic) dies in wafer-level fan-out package

An electronic device comprising:

• a first transceiver circuit in a first integrated circuit (IC) die, the first IC die being disposed in a wafer-level fan-out package;
• a second transceiver circuit in a second IC die, the second IC die being disposed in the wafer-level fan-out package;
• and
• physical channels in a redistribution structure of the wafer-level fan-out package, wherein:
• the first transceiver circuit is configured to transmit multiple first single-ended data signals and a first differential clock signal through a first subset of the physical channels to the second transceiver circuit;
• the second transceiver circuit is configured to transmit multiple second single-ended data signals and a second differential clock signal through a second subset of the physical channels to the first transceiver circuit;
• the second transceiver circuit is configured to capture data from the multiple first single-ended data signals using a first single-ended clock signal based on the first differential clock signal;
• and
• the first transceiver circuit is configured to capture data from the multiple second single-ended data signals using a second single-ended clock signal based on the second differential clock signal.

A method of operating an electronic device, the method comprising:

• generating a differential clock signal based on a first single-ended clock signal by a single-ended-to-differential converter circuit of a first transceiver circuit of a first integrated circuit (IC) die, the first IC die being disposed in a wafer-level fan-out package;
• serializing parallel data based on the first single-ended clock signal by a serializer circuit of the first transceiver circuit;
• transmitting, through physical channels of the wafer-level fan-out package, serialized data from the serializer circuit and the differential clock signal to a second transceiver circuit of a second IC die, the second IC die being disposed in the wafer-level fan-out package;
• and
• deserializing the serialized data based on the differential clock signal by a deserializer circuit of the second transceiver circuit.