Semiconductor device package having galvanic isolation and method therefor
AssigneeNXP USA, Inc.
InventorsBurton Jesse Carpenter, Fred T. Brauchler
Life of this patent
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Abstract
A semiconductor device package having galvanic isolation is provided. The semiconductor device package includes a package substrate having a first inductive coil. A first semiconductor die is attached to a first major surface of the package substrate. The first semiconductor die includes a second inductive coil substantially aligned with the first inductive coil. A second semiconductor die is attached to the first major surface of the package substrate. A wireless communication link between the first semiconductor die and the second semiconductor die is formed by way of the first and second inductive coils.
Claims20
A semiconductor device package comprising:
- a package substrate having a first inductive coil;
- a first semiconductor die attached to a first major surface of the package substrate, the first semiconductor die having a second inductive coil substantially aligned with the first inductive coil;
- and
- a second semiconductor die attached to the first major surface of the package substrate, a first wireless communication link between the first semiconductor die and the second semiconductor die formed by way of the first and second inductive coils.
A method of manufacturing a semiconductor device, the method comprising:
- providing a package substrate having a first inductive coil;
- attaching a first semiconductor die to a first major surface of the package substrate, the first semiconductor die having a second inductive coil substantially aligned with the first inductive coil;
- attaching a second semiconductor die to the first major surface of the package substrate;
- and
- forming a first wireless communication link between the first semiconductor die and the second semiconductor die including the first and second inductive coils.
A semiconductor device package comprising:
- a package substrate having a first inductive coil;
- a first semiconductor die attached to a first major surface of the package substrate, the first semiconductor die having a second inductive coil substantially aligned with the first inductive coil;
- and
- a second semiconductor die attached to the first major surface of the package substrate, the first semiconductor die configured to wirelessly communicate with the second semiconductor die by way of the first and second inductive coils.
The semiconductor device package of claim 18, further comprising a conductive path formed between the second semiconductor die and the first inductive coil.
Dependencies are inferred from the claim text.