Power module
AssigneeSharp Fukuyama Semiconductor Co., Ltd.
InventorsHiroki KANAI, Naomichi FUJII
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AssigneeSharp Fukuyama Semiconductor Co., Ltd.
InventorsHiroki KANAI, Naomichi FUJII
Estimating the term…
A power module comprises a first switching element and a second switching element mounted on a multilayer substrate; and a bypass capacitor formed on the multilayer substrate, wherein the multilayer substrate includes, a first wiring line pattern connecting a first terminal and the bypass capacitor, a second wiring line pattern connecting a second terminal and a third terminal, and a third wiring line pattern connecting a fourth terminal and the bypass capacitor, and the power module further includes, a first electrically conductive member connecting a non-mounting surface of the first switching element and a first connection portion provided on the second wiring line pattern, and a second electrically conductive member connecting a non-mounting surface of the second switching element and a second connection portion provided on the third wiring line pattern.
A power module comprising:
A power module comprising:
Dependencies are inferred from the claim text.