Electronic component package including stacked shield layers
AssigneeDIC Corporation
InventorsJun Shirakami, Norimasa Fukazawa
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Abstract
The present invention provides an electronic component package including an electronic component mounted on a circuit board having a ground pattern, a mold containing an epoxy resin that encapsulates the electronic component, and a shield layer formed on the mold. The shield layer is formed by stacking a metal particle layer, a copper plating layer, and a nickel plating layer in this order from the mold side, and the shield layer is grounded to the ground pattern. The present invention also provides a method for manufacturing the electronic component package. The electronic component package is excellent in the adhesion of the shield layer.
Claims7
An electronic component package comprising:
- an electronic component mounted on a circuit board having a ground pattern;
- a mold containing an epoxy resin that encapsulates the electronic component;
- a polymer layer formed on a surface of the mold;
- and
- a shield layer formed on the polymer layer, the shield layer comprising a metal particle layer, a copper plating layer, and a nickel plating layer in this order from the polymer layer,
- wherein the shield layer is grounded to the ground pattern,
- wherein metal particles in the metal particle layer are coated with a polymer dispersant having a functional group coordinates to the metal particles.
Dependencies are inferred from the claim text.