Semiconductor encapsulation structure and encapsulation method

An encapsulation method for a semiconductor structure, comprising:

• providing a circuit board, wherein the circuit board comprises at least one electromagnetic shield area and a non-electromagnetic shield area located on one side of the at least one electromagnetic shield area, wherein the circuit board internally comprises a number N of metal line layers stacked in sequence and insulating layers located between adjacent metal line layers, the number N of metal line layers are electrically connected through conductive vias on the insulating layers, a first pad located within the non-electromagnetic shield area on a first surface of the circuit board, a second pad located within the at least one electromagnetic shield area on the first surface of the circuit board, and a power supply ground line on the first surface of the circuit board are electrically connected to the number N of metal line layers, wherein the number N of metal line layers comprise an antenna structure and a power supply ground line-signal line hybrid distribution line layer, and N is an integer greater or equal to 1;
• forming a non-shield module and a shield module on the first surface of the circuit board, wherein the non-shield module is located within the non-electromagnetic shield area, the shield module is located within the at least one electromagnetic shield area, a connection end of the non-shield module is electrically connected to the first pad through a conductive wire, a connection end of the shield module is located on one surface of the second pad facing away from the circuit board and is electrically connected to the second pad;
• forming a thin film encapsulation layer on a side of the circuit board adjacent to the first surface, wherein the thin film encapsulation layer covers the non-electromagnetic shield area and the at least one electromagnetic shield area;
• and
• forming an electromagnetic shield structure on one side of the shield module facing away from the circuit board, and forming a closed space by the electromagnetic shield structure and the circuit board.