Selective use of different advanced interface bus with electronic chips
AssigneeAltera Corporation
InventorsDheeraj Subbareddy, Ankireddy Nalamalpu, Lai Guan Tang, Mahesh K. Kumashikar
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Abstract
A digitally communicative circuit may use standardized interfaces for connection and communication with other circuit components. Such digitally communicative circuit may benefit from using wider variety of interconnect schemes with the respective interfaces for transmission and reception of data. Some chiplets may communicate using a high data bandwidth interface while other chiplets may communicate using interfaces with lower data bandwidth. Alternate interface is introduced that may facilitate scaled communication with Advanced Interface Bus 2.0 without translation circuitry and with different data bandwidth.
Claims20
A semiconductor device comprising:
- an interface comprising:
- a physical layout of circuitry configured to be compatible with a high-speed protocol between die;
- and
- a plurality of bumps having a density less dense than specified for the high-speed protocol and suitable for a low-speed protocol, wherein the interface is configured to communicate using the high-speed protocol.
A chiplet comprising:
- a die having a first communication channel;
- and
- a first interface associated with the first communication channel, wherein the interface comprises:
- circuitry configured to support an advanced interface bus 2.0 (AIB 2.0) protocol connection;
- and
- a plurality of bumps having a density less dense than specified for the AIB 2.0 protocol, wherein the first interface is configured to communicate using the AIB 2.0 protocol.
A chip comprising:
- a top metal layer;
- and
- a redistribution layer, wherein the redistribution layer is configured to selectively use a first interface layer with a first communication architecture or a second interface layer with a second communication architecture as the top metal layer, wherein the first interface layer comprises a fraction of a number of bumps of the second interface layer, wherein the first communication architecture and the second communication architecture are configured to communicate using a same communication protocol.
Dependencies are inferred from the claim text.