Integrated circuit

An integrated circuit, comprising:

• a first plurality of conductive rails disposed in a first conductive layer and extending along a first direction, wherein the first plurality of conductive rails are configured to transmit power signals to at least one element of the integrated circuit;
• a second plurality of conductive rails disposed in the first conductive layer and extending along the first direction, wherein the second plurality of conductive rails are disposed between the first plurality of conductive rails and are separated from each other, in a layout view, wherein the second plurality of conductive rails are configured to transmit data signals to the at least one element of the integrated circuit;
• at least one first via disposed between the first conductive layer and a second conductive layer above the first conductive layer, and coupling one of the first plurality of conductive rails to a power rail disposed in the second conductive layer;
• and
• at least one first conductive segment disposed between the first conductive layer and the second conductive layer above the first conductive layer,
• wherein the at least one first conductive segment is at least partially overlapped with at least two adjacent conductive rails of the second plurality of conductive rails in a layout view, and the at least one first conductive segment contacts the at least two adjacent conductive rails of the second plurality of conductive rails and is separated from a signal rail that is disposed in the second conductive layer and next to the power rail.

A method, comprising:

• forming a plurality of conductive rails;
• forming a film structure on the plurality of conductive rails;
• patterning the film structure to form first patterns;
• filling the first patterns with conductive material to form a first conductive structure that includes at least one first conductive segment contacting at least a first conductive rail of the plurality of conductive rails;
• forming a dielectric structure covering the at least one first conductive segment;
• and
• removing part of the film structure and part of the dielectric structure to expose part of a second conductive rail of the plurality of conductive rails;
• and
• filling the conductive material in the removed part of the film structure and the removed part of the dielectric structure, to form a second conductive structure that includes a first via contacting the exposed part of the second conductive rail, and a signal rail contacting the first via.