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US 2022/0102276 A1Published application
Hybrid bridged fanout chiplet connectivity
AssigneeAdvanced Micro Devices, Inc.
InventorsRAHUL AGARWAL, MILIND S. BHAGAVAT
Life of this patent
Estimating the term…
Abstract
A chip for hybrid bridged fanout chiplet connectivity, the chip comprising: a central chiplet; one or more first chiplets each coupled to the central chiplet using a plurality of fanout traces; and one or more second chiplets each coupled to the central chiplet using one or more interconnect dies (ICDs).
Claims27
A chip for hybrid bridged fanout chiplet connectivity, the chip comprising:
- a central chiplet;
- one or more first chiplets each coupled to the central chiplet using a plurality of fanout traces;
- and
- one or more second chiplets each coupled to the central chiplet using one or more interconnect dies (ICDs).
1 more element
An apparatus for hybrid bridged fanout chiplet connectivity, the apparatus comprising:
- one or more components, wherein at least one component is operatively coupled to a chip and the chip comprises:
- a central chiplet;
- one or more first chiplets each coupled to the central chiplet using a plurality of fanout traces;
- and
- one or more second chiplets each coupled to the central chiplet using one or more interconnect dies (ICDs).
2 more elements
A method of hybrid bridged fanout chiplet connectivity, the method comprising:
- coupling, to a central chiplet of a chip, one or more first chiplets using a plurality of fanout traces;
- and
- coupling, to the central chiplet, one or more second chiplets using one or more interconnect dies (ICDs).
Dependencies are inferred from the claim text.