Semiconductor device

A semiconductor device comprising:

• a first wiring layer having a first main surface facing a thickness direction;
• a second wiring layer having a second main surface facing the same side as the first main surface in the thickness direction and being located away from the first wiring layer in a first direction orthogonal to the thickness direction;
• a first semiconductor element having a first main surface electrode provided on a side facing the first main surface in the thickness direction, the first semiconductor element being bonded to the first main surface;
• a second semiconductor element having a second main surface electrode provided on a side facing the second main surface in the thickness direction, the second semiconductor element being bonded to the second main surface;
• a first terminal electrically connected to the second main surface electrode;
• a first conductive member bonded to the first main surface electrode and the second main surface;
• and
• a second conductive member bonded to the second main surface electrode and the first terminal,
• wherein the first terminal is located away from the first wiring layer on the side facing the first main surface in the thickness direction, and
• wherein the second conductive member overlaps the first wiring layer when viewed along the thickness direction.