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US 2022/0102260 A1Published application
Power Module Having an Elevated Power Plane with an Integrated Signal Board and Process of Implementing the Same
AssigneeCree Fayetteville, Inc.
InventorsZach Cole, Steven Ericksen
Life of this patent
Estimating the term…
Abstract
A power module includes at least one electrically conductive power substrate; and a plurality of power devices arranged on and connected to the at least one electrically conductive power substrate. The power module further includes at least one elevated signal element electrically connected to the plurality of power devices and/or at least one elevated power plane electrically connected to the at least one electrically conductive power substrate and electrically connected to the plurality of power devices.
Claims28
A power module, comprising:
- at least one electrically conductive power substrate;
- a plurality of power devices arranged on and connected to the at least one electrically conductive power substrate;
- and
- the power module further comprising at least one of the following:
- at least one elevated signal element electrically connected to the plurality of power devices and arranged above the at least one electrically conductive power substrate;
- and
- at least one elevated power plane electrically connected to the at least one electrically conductive power substrate, electrically connected to the plurality of power devices, and arranged vertically offset from the at least one electrically conductive power substrate.
4 more elements
(canceled)
-26. (canceled)
A power module, comprising:
- at least one electrically conductive power substrate;
- a plurality of power devices arranged on and connected to the at least one electrically conductive power substrate;
- at least one elevated signal element electrically connected to the plurality of power devices;
- and
- at least one elevated power plane electrically connected to the at least one electrically conductive power substrate and electrically connected to the plurality of power devices,
- wherein the at least one elevated power plane is arranged vertically offset from the at least one electrically conductive power substrate;
- and
- wherein the at least one elevated signal element is arranged vertically offset from the at least one elevated power plane.
5 more elements
(canceled)
-52. (canceled)
Dependencies are inferred from the claim text.