Semiconductor device and corresponding method of manufacturing semiconductor devices
AssigneeSTMicroelectronics S.r.l.
InventorRoberto TIZIANI
Life of this patent
Estimating the term…
Abstract
A packaged semiconductor device includes a substrate having a first surface and a second surface opposite the first surface. At least one semiconductor die is mounted at the first surface of the substrate. Electrically-conductive leads are arranged around the substrate, and electrically-conductive formations couple the at least one semiconductor die to selected leads of the electrically-conductive leads. A package molding material is molded onto the at least one semiconductor die, onto the electrically-conductive leads and onto the electrically-conductive formations. The package molding material leaves the second surface of the substrate uncovered by the package molding material. The substrate is formed by a layer of electrically-insulating material.
Claims17
A device, comprising:
- an electrically-insulating substrate having a first surface and a second surface opposite the first surface;
- at least one semiconductor die mounted at said first surface of the electrically-insulating substrate at least one respective semiconductor die mounting location;
- a plurality of electrically-conductive leads of a leadframe arranged around said electrically-insulating substrate;
- a plurality of electrically-conductive formations coupling the at least one semiconductor die to selected leads in said plurality of electrically-conductive leads;
- and
- package molding material molded onto the at least one semiconductor die mounted at said first surface of the electrically-insulating substrate, onto the plurality of electrically-conductive leads of the leadframe and onto the plurality of electrically-conductive formations to form a flat, no-leads package leaving the second surface of said electrically-insulating substrate uncovered by said package molding material and leaving bottom surfaces of the plurality of electrically-conductive leads uncovered by said package molding material.
A method of manufacturing packaged semiconductor devices, comprising:
- providing at least one bare semiconductor device which includes:
- an electrically-insulating substrate, wherein the electrically-insulating substrate has a first surface and a second surface opposite the first surface;
- electrically-conductive formations formed at said first surface of the electrically-insulating substrate;
- and at least one semiconductor die mounted at said first surface of the electrically-insulating substrate;
- providing a leadframe comprising at least one set of electrically-conductive leads arranged around at least one respective semiconductor device location;
- positioning said at least one bare semiconductor device at said at least one respective semiconductor device location within said leadframe;
- electrically coupling said at least one semiconductor die to said electrically-conductive formations and to said at least one respective set of electrically-conductive leads;
- and
- molding package molding material onto said at least one bare semiconductor device to form a flat, no-leads package leaving the second surface of said electrically-insulating substrate uncovered by said package molding material and leaving bottom surfaces of the plurality of electrically-conductive leads uncovered by said package molding material.
Dependencies are inferred from the claim text.