Electronic component module
AssigneeMurata Manufacturing Co., Ltd.
InventorsHideki SHINKAI, Akio KATSUBE
Life of this patent
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Abstract
An electronic component module includes a substrate, a connector, an electronic component, a conductor wall, an insulating resin, and a conductive shield film. The connector and the electronic component are mounted on a first main surface of the substrate. The conductor wall has a cylindrical shape, is mounted on the first main surface of the substrate, and includes an interior space in which the connector is disposed. The insulating resin is provided on the first main surface. The conductive shield film is provided on a surface of the insulating resin. The insulating resin covers the electronic component and is disposed outside the conductor wall except the interior space of the conductor wall.
Claims20
An electronic component module comprising:
- a substrate having a first main surface;
- an electronic component mounted on the first main surface of the substrate;
- a mount component mounted on the first main surface of the substrate;
- a first insulating resin on the first main surface of the substrate;
- a conductive shield film on a surface of the first insulating resin;
- and
- a conductor wall separating the mount component and the electronic component, wherein:
- the first insulating resin comprises an opening portion,
- the mount component is in the opening portion such that the mount component is not covered by the insulating resin, and
- the conductor wall is in the opening portion.
Dependencies are inferred from the claim text.