Chip packaging method and chip structure

A chip structure, comprising:

• at least one semiconductor die having a die active surface and a die back surface opposed to each other;
• a protective layer formed on the die active surface, wherein the protective layer comprises a plurality of protective layer openings for exposing the die active surface from the protective layer;
• a metal unit having at least one metal feature, wherein the at least one metal feature comprises at least one connection pad having a connection pad front surface and a connection pad back surface opposed to each other;
• a molding layer for encapsulating the at least one semiconductor die, the protective layer and metal unit;
• and
• a first conductive structure on the at least one metal feature of the metal unit, the protective layer and the molding layer, wherein the first conductive structure is connected to the die active surface for connecting the at least one die to the meal unit,
• wherein the chip structure is connected with an external circuit via the first conducive structure.

A method of making a chip package for a power module, comprising:

• providing at least one semiconductor die having a die active surface and a die back surface opposed to each other, wherein the at least one semiconductor die has a thin profile between the die active surface and the die back surface for reducing electrical resistance for the power module;
• providing a driver circuit for controlling the at least one semiconductor die, wherein the driver circuit has a driver active surface and a driver back surface opposed to each other;
• forming a protective layer on the die active surface and the driver active surface, wherein the protective layer comprises a plurality of protective layer openings for exposing the die active surface and the driver active surface from the protective layer;
• disposing a metal unit enclosing the at least one semiconductor die and the driver circuit, wherein the metal unit has at least one metal feature, and the at least one metal feature further comprises at least one connection pad having a connection pad front surface and a connection pad back surface opposed to each other;
• forming a molding layer for encapsulating the at least one semiconductor die, the driver circuit, the protective layer and metal unit;
• and
• connecting the chip package with an external circuit via the at least one metal feature of the metal unit.