Semiconductor package and method of manufacturing a semiconductor package

A method of fabricating a semiconductor package comprising a first power semiconductor device, a second power semiconductor device and a control semiconductor device, the method comprising:

• providing a leadframe comprising first, second and third die pads and a plurality of leads, wherein the first, second and third die pads each have an upper surface and a lower surface and are spaced part from one another;
• mounting the first power semiconductor device on the upper surface of the first die pad;
• electrically coupling to the second die pad by one or more first connectors that extend between the first power device and the upper surface of the second die pad, wherein a lower surface of the second die pad is spaced apart from a side face of the semiconductor package by a distance that is greater than a length of the individual leads;
• and
• applying a mold compound such that the upper surface of the first, second and third die pads is arranged within the mold compound and the upper surface of the second die pad is either occupied by the one or more connectors or in direct contact with the mold compound.