US 2022/0102252 A1Published application

Semiconductor device

AssigneeRohm Co., Ltd.

InventorsYoshizo OSUMI, Hiroaki MATSUBARA, Tomohira KIKUCHI

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Abstract

There is provided a semiconductor device including: a conductive support including a first die pad and a second die pad having a potential different from a potential of the first die pad; a first semiconductor element mounted on the first die pad; a second semiconductor element mounted on the second die pad; and a sealing resin that covers the first semiconductor element, the second semiconductor element, and at least a portion of the conductive support.

Claims16

Dependent claims

A semiconductor device comprising:

a conductive support including a first die pad and a second die pad having a potential different from a potential of the first die pad;
a first semiconductor element mounted on the first die pad;
a second semiconductor element mounted on the second die pad;
and
a sealing resin that covers the first semiconductor element, the second semiconductor element, and at least a portion of the conductive support,
wherein the first semiconductor element includes:
a control part constituting an input-side circuit together with the first die pad;
and
a low-voltage drive part constituting a low-voltage output-side circuit that transmits and receives a signal to and from the input-side circuit,
wherein the second semiconductor element includes a high-voltage drive part constituting a high-voltage output-side circuit, which transmits and receives a signal to and from the input-side circuit, together with the second die pad,
wherein the conductive support further includes:
a plurality of input-side terminals arranged along a first direction orthogonal to a thickness direction, at least one of the plurality of input-side terminals being electrically connected to the input-side circuit;
a plurality of high-voltage output-side terminals arranged along the first direction, at least one of the plurality of high-voltage output-side terminals being electrically connected to the high-voltage output-side circuit;
and
a plurality of low-voltage output-side terminals arranged along the first direction on one side of the first direction with respect to the plurality of high-voltage output-side terminals, at least one of the plurality of low-voltage output-side terminals being electrically connected to the low-voltage output-side circuit,
wherein the sealing resin has:
a first side surface located on a first side in a second direction orthogonal to the thickness direction and the first direction, the plurality of input-side terminals protruding from the first side surface;
a second side surface located on a second side in the second direction, the plurality of high-voltage output-side terminals and the plurality of low-voltage output-side terminals protruding from the second side surface;
a third side surface located on a first side in the first direction and connected to the first side surface and the second side surface;
and
a fourth side surface located on a second side of the first direction and connected to the first side surface and the second side surface, and
wherein the conductive support is not exposed from the fourth side surface.

19 more elements

Dependencies are inferred from the claim text.

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Abstract

A semiconductor device comprising:

a conductive support including a first die pad and a second die pad having a potential different from a potential of the first die pad;
a first semiconductor element mounted on the first die pad;
a second semiconductor element mounted on the second die pad;
and
a sealing resin that covers the first semiconductor element, the second semiconductor element, and at least a portion of the conductive support,
wherein the first semiconductor element includes:
a control part constituting an input-side circuit together with the first die pad;
and
a low-voltage drive part constituting a low-voltage output-side circuit that transmits and receives a signal to and from the input-side circuit,
wherein the second semiconductor element includes a high-voltage drive part constituting a high-voltage output-side circuit, which transmits and receives a signal to and from the input-side circuit, together with the second die pad,
wherein the conductive support further includes:
a plurality of input-side terminals arranged along a first direction orthogonal to a thickness direction, at least one of the plurality of input-side terminals being electrically connected to the input-side circuit;
a plurality of high-voltage output-side terminals arranged along the first direction, at least one of the plurality of high-voltage output-side terminals being electrically connected to the high-voltage output-side circuit;
and
a plurality of low-voltage output-side terminals arranged along the first direction on one side of the first direction with respect to the plurality of high-voltage output-side terminals, at least one of the plurality of low-voltage output-side terminals being electrically connected to the low-voltage output-side circuit,
wherein the sealing resin has:
a first side surface located on a first side in a second direction orthogonal to the thickness direction and the first direction, the plurality of input-side terminals protruding from the first side surface;
a second side surface located on a second side in the second direction, the plurality of high-voltage output-side terminals and the plurality of low-voltage output-side terminals protruding from the second side surface;
a third side surface located on a first side in the first direction and connected to the first side surface and the second side surface;
and
a fourth side surface located on a second side of the first direction and connected to the first side surface and the second side surface, and
wherein the conductive support is not exposed from the fourth side surface.

19 more elements