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US 2022/0102249 A1Published application
Dual side cooling power module and manufacturing method of the same
AssigneeHyundai Mobis Co., Ltd.
InventorHanSin CHO
Life of this patent
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Abstract
A dual side cooling power module includes: a lower substrate including a recessed portion on at least one surface thereof, a semiconductor chip formed in the recessed portion, lead frames formed at both ends of the lower substrate, and an upper substrate formed on the semiconductor chip, a portion of the lead frames, and the lower substrate.
Claims7
1-9. (canceled)
A manufacturing method of a dual side cooling power module, the method comprising:
- forming a recessed portion on at least one surface of a lower substrate;
- forming a semiconductor chip in the recessed portion;
- forming lead frames at both ends of the lower substrate;
- and
- forming an upper substrate on the semiconductor chip, a portion of the lead frames, and the lower substrate.
2 more elements
Dependencies are inferred from the claim text.