Dummy die structures of a packaged integrated circuit device

A method comprising:

• coupling an integrated circuit (IC) die to a first region of a substrate;
• forming a dummy die structure on a second region of the substrate, wherein the dummy die structure is adjacent to the IC die, the dummy die structure comprising a polymer resin and a filler;
• and
• after forming the dummy die structure, forming a package mold structure which adjoins respective sides of the IC die and the dummy die, and adjoins the surface of the substrate.

A system comprising:

• a packaged device comprising:
• a substrate;
• an integrated circuit (IC) die coupled to a first region of the substrate;
• a dummy die structure adjacent to the IC die and coupled to a second region of the substrate, the dummy die structure comprising a polymer resin and a filler;
• and
• a package mold structure which adjoins respective sides of the IC die and the dummy die, and adjoins the surface of the substrate;
• and
• a display device coupled to the packaged device, the display device to display an image based on a signal communicated with the IC die.