Semiconductor device and manufacturing method
AssigneeKioxia Corporation
InventorsRyo KAMODA, Hideki TAKAHASHI
Life of this patent
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Abstract
A semiconductor device includes a substrate that has a first surface and a second surface on which a plurality of solder balls are provided, a semiconductor memory on the first surface of the substrate, a controller arranged on the first surface of the substrate, separated from the semiconductor memory along a first direction, and configured to control the semiconductor memory, a graphite sheet extending along the first direction above the controller and the semiconductor memory, and a first sealing material that seals the semiconductor memory, the controller, and the graphite sheet.
Claims20
A semiconductor device, comprising:
- a substrate that has a first surface and a second surface on which a plurality of solder balls are provided;
- a semiconductor memory on the first surface of the substrate;
- a controller on the first surface of the substrate, separated from the semiconductor memory along a first direction, and configured to control the semiconductor memory;
- a graphite sheet extending along the first direction above the controller and the semiconductor memory;
- and
- a first sealing material that seals the semiconductor memory, the controller, and the graphite sheet.
A semiconductor device, comprising:
- a substrate that has a first surface and a second surface on which a plurality of solder balls are provided;
- a semiconductor memory on the first surface of the substrate;
- a controller on the first surface of the substrate, separated from the semiconductor memory along a first direction, and configured to control the semiconductor memory;
- a heat conductive plate above the controller;
- and
- a sealing material that seals the semiconductor memory, the controller, and the heat conductive plate.
A manufacturing method of a semiconductor device, the method comprising:
- forming a plurality of solder balls on a back surface of a substrate;
- disposing a semiconductor memory on a front surface of the substrate;
- disposing a controller configured to control the semiconductor memory on the front surface of the substrate, the controller being separated from the semiconductor memory along a first direction;
- disposing a graphite sheet above the semiconductor memory and the controller along the first direction;
- sealing with a first sealing material the semiconductor memory, the controller, and the graphite sheet;
- disposing a second heat conductive plate on the graphite sheet;
- and
- sealing with a second sealing material the graphite sheet and the second heat conductive plate.
Dependencies are inferred from the claim text.