Semiconductor package including heat spreader layer
AssigneeSamsung Electronics Co., Ltd.
InventorsJingu Kim, Sangkyu Lee, Yongkoon Lee, Seokkyu Choi
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Abstract
A semiconductor package includes a connection layer, a semiconductor chip disposed at a center portion of the connection layer, an adhesive layer disposed on the semiconductor chip, a heat spreader layer disposed on the adhesive layer, and a lower redistribution layer disposed on the connection layer and a bottom surface of the semiconductor chip. A width of the adhesive layer is the same as a width of the semiconductor chip, and a width of the heat spreader layer is less than the width of the adhesive layer.
Claims20
A semiconductor package comprising:
- a connection layer;
- a semiconductor chip disposed at a center portion of the connection layer;
- an adhesive layer disposed on the semiconductor chip;
- a heat spreader layer disposed on the adhesive layer;
- and
- a lower redistribution layer disposed on the connection layer and a bottom surface of the semiconductor chip,
- wherein a width of the adhesive layer is the same as a width of the semiconductor chip, and a width of the heat spreader layer is less than the width of the adhesive layer.
A semiconductor package comprising:
- a connection layer;
- a semiconductor chip surrounded by the connection layer;
- an adhesive layer disposed on the semiconductor chip;
- a plurality of heat spreader layers disposed on the adhesive layer;
- and
- a lower redistribution layer disposed on the connection layer and a bottom surface of the semiconductor chip,
- wherein
- a width of the adhesive layer is the same as a width of the semiconductor chip, and a width of each of the plurality of heat spreader layers is less than a width of the adhesive layer, and
- the plurality of heat spreader layers are arranged in a lattice pattern.
A semiconductor package comprising:
- a semiconductor chip;
- an adhesive layer disposed on the semiconductor chip;
- a thin film layer disposed on the adhesive layer;
- a heat spreader layer disposed on the thin film layer;
- an encapsulant covering the semiconductor chip, the adhesive layer, and the heat spreader layer;
- a lower redistribution layer disposed on a bottom surface of the semiconductor chip and a bottom surface of the encapsulant, the lower redistribution layer including an insulation layer and a wiring pattern;
- an upper redistribution layer disposed on the encapsulant;
- a conductive via connecting the lower redistribution layer to the upper redistribution layer;
- an external connection terminal disposed on a bottom surface of the lower redistribution layer and electrically connected to the semiconductor chip and the conductive via through the wiring pattern;
- and
- a heat dissipation via passing through the encapsulant and the upper redistribution layer and vertically overlapping the heat spreader layer,
- wherein a width of the adhesive layer is the same as a width of the semiconductor chip, and a width of the thin film layer is less than a width of the adhesive layer and is the same as a width of the heat spreader layer.
Dependencies are inferred from the claim text.